Heat Activated Tape
Heat activated tape is usually tack-free until it is activated by a heat source, and is not considered to be a pressure sensitive tape. Heat-activated (hot melt) adhesive systems require a defined period of time at elevated temperatures (normally 180˚F or higher) to achieve final bonding strength. Temperature, pressure and dwell time are used to effect a final cure and bond. Hot Melt Tapes have very strong holding power and wins when it comes to adhesion strength. It is very flexible and has significantly higher adhesion as compared to acrylic tape on most surfaces including fiberboard.
Heat activated adhesives are generally applied to a substrate via roll coat operation. The coated material is in a non-tacky state until heat is applied, which activates the bonding property. Bemis Seam Tape and Water When heat and pressure are applied, the tape is activated, and ultimately provides an extremely high bond. The heat activation point is entirely dependent on the substrate sensitivity and scorch point.
Advantages of Heat Activated Tape
Can be designed for rigid or flexible applications
Adheres to a wide variety of materials
Excellent for induction curing and seal
EPDM extrusion profile bonding for the automotive industry
Electrical appliance industry
Provides excellent performance bonding strength to most rubber, EPDM, PU and PVC based plastic materials.